Preventing thermal cycling and vibration failures in electronic equipment
Vibration Analysis for Electronic Equipment by Dave S. Steinberg
[PDF] Preventing Thermal Cycling and Vibration Failures in Electronic Equipment Full Colection
Thermal Cycling Demonstration
The lowest-priced brand-new, unused, unopened, undamaged item in its original packaging where packaging is applicable. Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. See details for additional description. Skip to main content. Steinberg , Hardcover Be the first to write a review. About this product.
Register here! Pass this on to your co-workers! Dave Steinberg. He is the principal engineer at Carlson Mechanical Engineering and has provided mechanical analysis services to Northrop Grumman, Physical Optics Corporation, and multiple other electronic manufacturers for military and commercial applications. Steve holds a Masters in Mechanical Engineering and currently works at Jet Propulsion Laboratory JPL performing thermal and structural analyses on space based electronic hardware. Steve learned the classical techniques for analyzing electronic hardware from Joel Sloan author Design and Packaging of Electronic Equipment who was a colleague of Dave Steinberg author of multiple thermal and vibration analysis books at Litton Guidance and Control Systems. Steve has expanded the classical techniques to include modern solid modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time.
This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature. Dave S. Convert currency. Add to Basket. Book Description John Wiley and Sons, Condition: New. Dispatched, from the UK, within 48 hours of ordering.